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| LOW NOISE PHEMT MMIC * FEATURES 18 GHz to 22 GHz Frequency Band 2.5 dB Noise Figure 22 dB Gain 5 dBm Output Power at Saturation 12 dB Input/Output Return Loss +3 V Single Bias Supply LMA419 * DESCRIPTION AND APPLICATIONS The Filtronic Solid State LMA419 is a low noise PHEMT amplifier that operates from 18 to 22GHz. This 3-stage reactively matched amplifier provides 22dB nominal gain with 2.5dB typical noise figure and saturated power output of +5dBm The LMA419 is designed for commercial mm-W (millimeter-wave) PCN/PCS applications. Ground is provided to the circuitry through vias to the backside metallization. * ELECTRICAL SPECIFICATIONS @ TAmbient = 25C (VDD = +3.0V, ZIN = ZOUT = 50) Parameter Frequency Band Small Signal Gain Small Signal Gain Flatness Noise Figure Input Return Loss Output Return Loss Reverse Isolation Symbol F S21 S21 NF S11 S22 S12 IDS = 20 mA Test Conditions Min 18 18 22 0.8 2.5 -12 -12 -40 1.0 3.0 -9 -9 Typ Max 22 Units GHz dB dB dB dB dB dB Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 12/05/00 Email: sales@filss.com LOW NOISE PHEMT MMIC * ABSOLUTE MAXIMUM RATINGS Parameter Drain Voltage Operating Current RF Input Power Total Power Dissipation Channel Operating Temperature Storage Temperature Maximum Assembly Temperature (1 min. max.) Notes: * * * Symbol VD IOP PIN PTOT TCH TSTG TMAX Test Conditions TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C -- -- -65 Min Max 4 90 -10 0.4 150 165 300 Units V mA dBm W C C C LMA419 * Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. Recommended Continuous Operating Limits should be observed for reliable device operation. Power Dissipation defined as: PTOT (PDC + PIN) - POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 12/05/00 Email: sales@filss.com LOW NOISE PHEMT MMIC * ASSEMBLY DRAWING LMA419 Notes: * * * * Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150C for 45 minutes. Bond on bond or stitch bond acceptable. Conductor over conductor acceptable. Conductors must not short. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 12/05/00 Email: sales@filss.com LOW NOISE PHEMT MMIC * MECHANICAL OUTLINE LMA419 Notes: * * * * All units are in microns (m). All bond pads are 100 X 100 m 2 . Bias pad (VDD ) size is 100 X 121.5 m 2 . Unless otherwise specified. * HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. All information and specifications are subject to change without notice. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 12/05/00 Email: sales@filss.com |
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